PRODUCTS

PRODUCTS FEATURES

AC-107

Acidic Aluminium Etchant

    1. Particularly designed for pre-treatment process on aluminum alloy substrate

    2. Erode, descale, and polish the surface without hurting the substrate

    3. Achieve leveling effect for the subsequent zincating process

    4. The hyperactivity greatly reduces the number of defective products

ZN-408

Zincator for Aluminum Alloy

    1. Particularly used as pre-treatment for aluminum & aluminum alloy substrates

    2. The zincated films feature excellent coating adhesion, superior leveling, and highly uniform

ABS

Wetting Agent

    1. Treatment of ABS Wetting Agent prior to ABS Etching Agent can prevent bubbles forming, improving the adhesion strength of deposited metal to the plastic substrate

    2. Featuring wetting, emulsifying, cleansing, and hydrophilic effects, together with benefiting the subsequent etching uniformity

AP-40

Swelling Agent

    1. Particularly designed as pre-surface etching for PC and high PC content ABS/PC

    2. Effectively soften PC texture and improve the surface-etching uniformity

    3. Improve adhesion strength of deposited metal to plastic substrate, achieving good coating coverage

AP-30

Etching Agent

    1. Improve the etching effect and stabilize the surface, further enhancing the activation efficiency

    2. Improve the uniformity and etching speed; suppress the chrome mist evaporation

AP-35

pH Neutralizer

    Effectively remove the residue of chromic acid molecules on the surface of workpiece after etching, in order to prevent chrome contamination in the later processes

AP-3200

Sensitizer

    1. The activation for ABS surface to accept the subsequent plating processes

    2. Strong adhesion strength of metal coating, improving the activation effect

AP-3205

Surface Activator

    1. Particularly used in pre-treatment for ABS+PC or ABS, providing excellent activation

    2. Rapidly activate the ABS surface

    3. Featuring stable reagent, non-aging, less dosage, simple management

AP-3209

Accelerator

    1. Particularly used for ABS substrates

    2. Gently remove excess tin ions from the surfaces to expose palladium colloids, benefiting the subsequent electroless nickel coverage

EAC-263

Electroless Nickel Plating Additive

    1. Fine coating of electroless nickel crystals

    2. Low temp., fast deposition, simple operation

    3. Stable reagent, easy management

    4. Slow aging speed, extended service life

BC-31C

Paraffin Remover

    1. Particularly applied on cleaning iron, zinc alloy and copper alloy without hurting the substrate

    2. Non-toxic, non-corrosive, nonflammable; safe operation

    3. For substrate with severe scales, use with ultrasonic to achieve the best cleaning effect