PRODUCTS

1. Particularly designed for pre-treatment process on aluminum alloy substrate

2. Erode, descale, and polish the surface without hurting the substrate

3. Achieve leveling effect for the subsequent zincating process

4. The hyperactivity greatly reduces the number of defective products

1. Particularly used as pre-treatment for aluminum & aluminum alloy substrates

2. The zincated films feature excellent coating adhesion, superior leveling, and highly uniform

1. Treatment of ABS Wetting Agent prior to ABS Etching Agent can prevent bubbles forming, improving the adhesion strength of deposited metal to the plastic substrate

2. Featuring wetting, emulsifying, cleansing, and hydrophilic effects, together with benefiting the subsequent etching uniformity

1. Particularly designed as pre-surface etching for PC and high PC content ABS/PC

2. Effectively soften PC texture and improve the surface-etching uniformity

3. Improve adhesion strength of deposited metal to plastic substrate, achieving good coating coverage

1. Improve the etching effect and stabilize the surface, further enhancing the activation efficiency

2. Improve the uniformity and etching speed; suppress the chrome mist evaporation

Effectively remove the residue of chromic acid molecules on the surface of workpiece after etching, in order to prevent chrome contamination in the later processes

1. The activation for ABS surface to accept the subsequent plating processes

2. Strong adhesion strength of metal coating, improving the activation effect

1. Particularly used in pre-treatment for ABS+PC or ABS, providing excellent activation

2. Rapidly activate the ABS surface

3. Featuring stable reagent, non-aging, less dosage, simple management

1. Particularly used for ABS substrates

2. Gently remove excess tin ions from the surfaces to expose palladium colloids, benefiting the subsequent electroless nickel coverage

1. Fine coating of electroless nickel crystals

2. Low temp., fast deposition, simple operation

3. Stable reagent, easy management

4. Slow aging speed, extended service life

1. Single additive addition, convenient management

2. Fine coating structures, excellent corrosive-resistance

3. Reduced cost by direct nickel plating after this process

1. Single additive addition, easy for daily production

2. Efficiently achieve high levelness coating

3. Direct nickel plating with reduced roughness and plating void

4. Reduced anode oxidation; improved conductivity

1. Cyanide-free, new copper plating technique of alkaline pyrophosphate salt

2. Direct plating on the surface of steel, zinc alloy, zinc-treated aluminum alloy, etc.

3. Smooth, fine, soft, and porous-free coating

4. Excellent dispersion and enhanced coverage power

5. pH adjust with potassium carbonate

1. Single additive addition, wide application, simple management

2. Highly smooth and flexible coating; obtain the mirror-gloss effect

3. Highly concentrated, use after 30 times of dilution

1. Bright and uniform coating, excellent levelness at low current density area

2. High current efficiency and exceptional adhesion

3. Reduced plating time and costs

4. Add R.S. 752 to level and brighten if faults at high or low potential regions